ECE-5224: Principles of Electronics Packaging
Description: Electrical, thermal, mechanical, and thermomechanical design of electronics packaging. Materials and process selection guidelines for the fabrication and reliability of single- and multi-chip electronics packages. Methods for characterization and testing of electronics packages. Failure mechanisms and design for reliability. Hands-on project experience on electronics packaging. Pre: Graduate Standing.
Pathways: N/A
Course Hours: 3 credits
Corequisites: N/A
Crosslist: N/A
Repeatability: N/A
Sections Taught: 5
Average GPA: 3.68 (A-)
Strict A Rate (No A-) : 55.30%
Average Withdrawal Rate: 0.00%
| Christina M Dimarino | 2024 | 70.6% | 27.3% | 2.1% | 0.0% | 0.0% | 0.0% | 3.66 | 4 |
| William A Davis | 2004 | 83.3% | 16.7% | 0.0% | 0.0% | 0.0% | 0.0% | 3.78 | 1 |