ECE-4254: Principles of Electronics Packaging
Description: Electrical and thermal design of electronics packaging using finite element analysis software. Materials and process selection guidelines for the fabrication of single- and multi-chip electronics packages. Methods for characterization and testing of electronics packages. Failure mechanisms and design for reliability. Hands-on project experience on electronics packaging.
Pathways: N/A
Course Hours: 3 credits
Corequisites: N/A
Crosslist: N/A
Repeatability: N/A
Sections Taught: 4
Average GPA: 3.04 (B+)
Strict A Rate (No A-) : 10.53%
Average Withdrawal Rate: 0.00%
| Christina M Dimarino | 2024 | 30.8% | 52.1% | 11.9% | 5.3% | 0.0% | 0.0% | 3.04 | 4 |